UDIQUE 891
UDIQUE 891 is an ammonia-based process providing uniform electroless nickel deposits. It serves as a conductive nickel layer, well bonded to the plastic surface. The process is simple to operate and stands out with excellent robustness and stability.
Industries Served
Automotive
Building & Hardware
Fashion & Design
Household Appliances
Plumbing & Fittings
Features & Benefits
- Lead-free
- High stability – excellent robustness
- High efficiency with low working temperature
- Suitable for immersion copper and copper / nickel strike
Sustainability
We are committed to delivering sustainable solutions for the surface finishing industry. Our lead-free portfolio, including UDIQUE 891, offers a safe and sustainable electroless nickel process, coupled with unmatched performance.