UDIQUE 835
UDIQUE 835 is a low temperature, high-speed electroless copper process. Producing a bright pink and fine-grained deposit, UDIQUE 835 can be used on both ABS and PC/ABS substrates.
Industries Served
Packaging
Building & Hardware
Fashion & Design
Household Appliances
Plumbing & Fittings
Features & Benefits
- Nickel-free system that can be used as a nickel alternative
- Excellent stability
- High plating speed (0.5-0.8µm deposition rate in 6-8 min)
- Good adhesion
Sustainability
At MacDermid Enthone, safety and sustainability are at the heart of innovation. With a comprehensive portfolio of nickel-free processes, including UDIQUE 835, we are proud to deliver future-focused surface finishing solutions to customers worldwide.