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Copper

CUPROSTAR IC

CUPROSTAR IC

The CUPROSTAR IC process provides excellent, evenly distributed immersion copper deposits with good adhesion characteristics, enabling acid copper to be applied directly after the treatment without the need for electrolytic reinforcement by pre-nickel plating.

parts treated with copper on rack

Features & Benefits

  • Liquid product – easy to handle
  • Improved conductivity – reduced risk of contact “burn-off"
  • Thin copper deposit – reduced dissolution of the electroless nickel layer

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