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Copper

CUPROSTAR 594

CUPROSTAR 594

CUPROSTAR 594 is designed for improved low current density coverage, increased throwing power, more uniform leveling from the subsequent bright acid copper process, and a decreased tendency for “burn-off”. 

part treated with copper plating process

Features & Benefits

  • Sulfuric acid based – no need to rinse before acid copper
  • High conductive layer
  • Good coverage, improved throwing power
  • Fine-grained and ductile deposits
  • Excellent base layer for acid copper plating

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