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Specialty EN

ENPLATE™ AL 100

ENPLATE™ AL 100

ENPLATE™ AL 100 electroless nickel system is specifically formulated to deposit a thin, uniform nickel phosphorous layer onto zincated aluminum substrates and/or zinc die cast prior to plating in a conventional acid electroless nickel bath. 

Versatility

Utilizing the ENPLATE AL 100 on aluminum alloys allows the EN plater to profit from the full potential of an acid electroless nickel bath without the concern of blistering or poor adhesion as the bath ages.

Operational advantage

The process has a very high tolerance for contamination, particularly zinc contamination which gives the solution a very long life and prevents this contamination from being introduced into a subsequent electroless nickel process.

Economic advantage

The ENPLATE AL 100 process is very economical due to the thinness of the layers obtained, yielding a very long life.

reduced-ion-electroless-nickel

Features & Benefits

  • Maximum stability  
  • Improves the life of conventional electroless nickel bath
  • High tolerance to contaminants 
  • Long bath life 
  • Easy to operate and maintain 
  • Plates at room temperature directly onto properly prepared substrates 

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